Fifteen years in the semiconductor backend. Rooted in the world's most concentrated electronics manufacturing ecosystem: the Shenzhen-Greater Bay Area.
EMS-IC was founded by a team of semiconductor process engineers who saw a gap: advanced packaging capabilities were concentrated in captive OSATs, leaving fabless companies with limited options for flexible, responsive assembly partners.
Starting with a single wire bond line in Longgang, we expanded steadily: flip chip capabilities in 2013, WLCSP in 2016, and full system-in-package integration by 2019. Each expansion was driven by customer demand for ever-finer pitches, thinner packages, and higher integration density.
Today we run a multi-line facility with cleanroom environments from ISO Class 6 to Class 7, serving customers across consumer, automotive, industrial, and medical segments. Our engineering team brings experience from tier-1 OSATs and foundries.
Established in Longgang, Shenzhen. Single wire bond line serving domestic IC design houses.
First flip chip BGA line. Initial capability: 0.5mm pitch, up to 35mm body. ISO 9001 certification.
Fan-in WLCSP line. Expansion to 300mm wafer capability. IATF 16949 certification for automotive.
System-in-package line. MEMS cavity packaging. X-ray CT inspection. ISO 14001 environmental certification.
0.3mm BGA pitch in production. 130µm Cu pillar flip chip. 01005 passive handling. Pingshan facility expansion.
Dedicated English-language export desk. Expanded international customer base across 14 countries.
Located in the Longgang-Pingshan semiconductor corridor, at the center of the world's densest electronics supply chain. 60 minutes from Shenzhen Bao'an International Airport. Same-day access to major foundries and substrate suppliers.
Cleanroom: 3,000 m² ISO Class 6/7
Lines: Flip Chip, Wire Bond, WLCSP, SIP, MEMS
Capacity: 50M+ units/month
Cleanroom: 2,000 m² ISO Class 6/7
Lines: Advanced Flip Chip, Cu Pillar, WLCSP
Opened 2022
We operate within the established semiconductor supply chain. Wafers arrive directly from partner foundries. Substrates sourced from tier-1 suppliers. Every link in the chain is audited and qualified.
World's largest dedicated semiconductor foundry. Advanced nodes from 7nm to 0.18µm. Wafers shipped directly to our facility with full lot traceability.
Mainland China's largest foundry. Mature and advanced nodes. Strategic proximity advantage: same-city logistics with Shenzhen fab.
Taiwan-based global foundry. Broad process portfolio from 14nm to specialty technologies. Long-term wafer supply agreements in place.
Substrates and leadframes from the world's largest OSAT. BT, ABF, and MCE substrates qualified across our package portfolio.
Japanese high-density substrate supplier. Advanced flip chip substrates for fine-pitch and large-body applications.
Epoxy mold compounds and die attach materials. Halogen-free green compounds qualified. NCF and NCP for advanced flip chip.
Process engineers, not salespeople, handle your technical inquiry. Your package requirements are reviewed by someone who has run the line.
Every decision backed by DOEs, SPC data, and reliability test results. No guesswork. No "should be fine." Only what the data supports.
Technical proposals within 24 hours. Engineering samples within 2-4 weeks. Volume ramp within 8-12 weeks. No bureaucracy. Direct access to decision-makers.
Weekly process review meetings. Monthly reliability data review. Quarterly technology roadmap updates. We learn from every assembly — good and bad.
Our export desk provides English-language technical communication, documentation, and logistics coordination. Every customer receives a dedicated technical contact who speaks semiconductor — not just the language.
Export documentation package includes: Certificate of Conformance, reliability qualification report, X-ray inspection results (per lot), MSL labeling, and RoHS/REACH compliance statements. All documents in English.
Whether you are a fabless startup bringing up a first prototype or a volume OEM optimizing an established supply chain, we have the process capability and engineering depth to support your program.