IC packaging quality is non-negotiable. Every process is governed by JEDEC, IPC, and IATF standards. Every lot is traceable. Every failure mode is analyzed.
Our quality management system is certified to the most demanding standards in semiconductor manufacturing. Annual audits with zero major findings.
International automotive quality standard combining ISO 9001 with automotive-specific requirements. Mandatory for automotive supply chain. Covers defect prevention, risk management, and continuous improvement in the semiconductor backend process.
Internationally recognized quality management standard. Process-oriented approach to quality across all operations: document control, corrective actions, management review, internal audit, and continuous improvement.
Environmental management system covering waste reduction, chemical handling, RoHS/REACH compliance, and green packaging initiatives. Halogen-free mold compounds and lead-free finishes as standard.
Full suite of JEDEC solid-state device reliability test methods: A101 (TC), A104 (thermal cycling), A108 (HTOL), A110 (HAST), A113 (preconditioning). All test data documented in qualification reports.
Highest class of electronics assembly acceptance criteria. Class 3 requires continued high performance where equipment downtime cannot be tolerated. Applied to all wire bond, solder joint, and assembly inspection.
Moisture sensitivity level classification and handling per joint industry standards. MSL 1-6 with associated floor life, bake conditions, and dry pack requirements. Full MSL testing in-house with controlled humidity chambers.
Contamination is the enemy of yield. Multi-class cleanroom environment maintained to ISO 14644-1 standards with continuous particle monitoring.
Full ESD protected area (EPA) per ANSI/ESD S20.20. Conductive flooring, ionizing blowers, wrist strap monitoring, and continuous ground verification. All personnel trained and certified annually.
J-STD-033 compliant moisture management. MSL-labeled storage, floor-life tracking via MBB opening timestamps, automated bake scheduling based on exposure time, and dry pack for outgoing shipments.
ROSE (Resistivity of Solvent Extract) testing per IPC-TM-650 2.3.25. Ion chromatography for precise species identification. Cleanliness limits enforced at every wet process step and before sealing.
Real-time SPC on all critical parameters: wire bond pull strength, die shear, ball shear, solder joint X-ray void percentage, molding compound viscosity, and coplanarity. CpK target ≥ 1.67.
Full lot genealogy from wafer receipt to shipment. 2D matrix code on each package (optional). Process data logged per strip/tray with timestamps. Query any package's complete manufacturing history within seconds.
Structured 8D problem-solving methodology. Every non-conformance triggers containment within 24 hours, root cause analysis using 5-Why/Ishikawa, corrective action verification, and horizontal deployment across all lines.
Every new package design and process change undergoes a full reliability qualification per JEDEC JESD47 before entering volume production.
JESD22-A104. Thermal cycling between extreme temperatures to evaluate thermo-mechanical stress on solder joints and interfaces.
JESD22-A106. Rapid thermal transient testing using liquid-to-liquid bath method. Evaluates sudden thermal gradient resistance.
JESD22-A110/A118. Highly accelerated stress test under elevated temperature, humidity, and pressure with/without bias.
JESD22-A102. Saturated steam at elevated pressure to evaluate moisture resistance of package materials.
JESD22-A103. Long-term storage at elevated temperature to evaluate intermetallic growth and material degradation.
JESD22-A113. Simulated reflow after moisture soak to classify moisture sensitivity level. Mandatory before reliability testing.
MIL-STD-883 Method 2011. Destructive and non-destructive wire pull testing. Ball shear per JESD22-B116.
MIL-STD-883 Method 2019. Evaluates die attach material integrity after environmental stress.
JESD22-B102. Solder bath dip test to evaluate lead/ball wetting characteristics.
2D transmission and 3D CT X-ray for void analysis, wire sweep, and solder joint integrity verification.
| Standard | Title | Scope |
|---|---|---|
| JESD22-A104 | Temperature Cycling | Component-level thermal cycling test method |
| JESD22-A108 | High Temperature Operating Life | HTOL test for electromigration and TDDB |
| JESD22-A110 | HAST (Biased) | Highly accelerated temperature/humidity stress |
| JESD22-A113 | Preconditioning | MSL classification flow prior to reliability |
| JESD22-B102 | Solderability | Solder bath dip and wetting balance |
| JESD22-B116 | Ball Shear | Solder ball shear test method |
| J-STD-020 | MSL Classification | Moisture/reflow sensitivity classification |
| J-STD-033 | MSL Handling | Handling, packing, shipping of moisture-sensitive |
| IPC-A-610 | Acceptability (Class 3) | Highest class: no downtime permitted |
| IPC-7095 | BGA Design & Assembly | BGA process implementation and inspection |
| MIL-STD-883 | Test Method Standard | Microcircuits: bond pull (2011), die shear (2019) |
| ANSI/ESD S20.20 | ESD Control Program | Protection of electrical/electronic parts |
For detailed quality system documentation, cleanroom certification, or a plant audit, contact our quality team.